Accurate, Rapid, High Frequency Empirically Based Predictive Modeling Of Arbitrary Geometry Planar R - Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions

A novel technique is presented for the high speed, accurate, predictive modeling of arbitrary geometry integrated resistor structures manufactured in a variety of technologies, including those of both multichip modules (MCM’s) and integrated circuits (IC’s). The technique is based upon generating test structures in the process of interest, performing measurements, and extracting the behavior of a few key well identified building blocks. These building blocks can then be used for generating circuit models of other any structure created by valid combinations of those building blocks, which can then be simulated in a standard circuit simulator to predict behavior. The procedure has been experimentally verified, and shows good agreement with actual measurements up to 5–10 GHz. In addition, the model validity has been tested in several circuits by comparing the model predicted results against results obtained using the HP MDS simulator which uses measured parameters directly, with very good results. Since lumped element circuits are generated by this method, structure prediction speed is determined by circuit size and simulator small signal analysis time. The method is versatile and is well suited for circuit design applications.